this is information on a product in full production. august 2013 docid023414 rev 2 1/9 9 CPL-WBF-00D3 wide band directional coupler with iso port datasheet - production data features ? 50 ? nominal input / output impedance ? wide operating frequency range (698 mhz to 2700 mhz) ? low insertion loss ? 30 db coupling factor with high flatness ? high directivity ? high esd robustness (iec 61000-4-2 level 4) ? flip chip package ? small footprint benefits ? very low profile (< 560 m thickness after reflow) ? lead-free package ? high rf performance ? rf module size reduction ? 50 ? nominal input / output impedance ? fully symmetrical design applications ? quad-band power amplifier module ? quad-band front end module ? gsm / wcdma / lt e mobile phone figure 1. pin configuration (top view) description the CPL-WBF-00D3 is a wide-band directional coupler designed to measure rf antenna output power in gsm / wcdma / td-scdma / lte applications. this coupler has been customized for wide band operating frequencies (egsm, cell, pcs, dcs, td-scdma, wcdma and lte) with less than 0.30 db insertion losses in the bandwidth (698 mhz to 2700 mhz). the CPL-WBF-00D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performance. the device is delivered 100% tested in tape and reel. flip chip (6 bumps) in out cpl iso gnd gnd www.st.com
characteristics CPL-WBF-00D3 2/9 docid023414 rev 2 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter frequency band test condition value unit min. typ. max. p in input power rf in cw 698-880 30 dbm dc 50% cw 880-915 35 30 cw 1428-1661 30 dc 50% cw 1710-1910 33 30 cw 1920-2170 27 cw 1920-2025 30 cw 2500-2700 30 v esd esd ratings iec61000-4-2 (c = 150 pf, r = 330 ? , 10 shots with both polarities and each condition, cumulative method) rf in , rf out , air discharge rf in , rf out , contact discharge 15 8 kv kv v esd (hbm) human body model, jesd22-a114-b, all i/o 2 kv v esd (mm) machine model, jesd22-a115-a, all i/o 100 v v esd (cdm) charge device model, jesd22-c101-c, all i/o 500 v t op operating temperature -30 +85 c table 2. electrical characteristics (t amb = 25 c) - impedances symbol parameter value unit min. typ. max. z out nominal output impedance 50 ? z in nominal input impedance 50 ? z cpld nominal coupling impedance 50 ? z iso nominal isolated port impedance 50 ?
docid023414 rev 2 3/9 CPL-WBF-00D3 characteristics 1.1 rf measurements figure 4. directivity table 3. electrical characteristics (t amb = 25 c) - rf performance symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 698 2700 mhz i l insertion loss in bandwidth from 698 mhz to 2700 mhz 0.15 0.3 db r l return loss in bandwidth 15 db cpld coupling factor 29 33 db dir coupler directivity 20 db figure 2. insertion loss figure 3. coupling factor -0.02 -0.04 -0.06 -0.14 -0.08 -0.16 -0.18 -0.10 -0.12 -0.20 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 f (g z) h insertion loss (db) -29.0 -29.5 -30.0 -31.5 -30.5 -32.0 -32.5 -31.0 -33.0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 coupling factor (db) f (g z) h 28 27 26 23 25 22 21 24 20 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 directivity (db) f (ghz)
characteristics CPL-WBF-00D3 4/9 docid023414 rev 2 figure 5. rl in figure 6. rl out -10 -12.5 -15.0 -25.0 -17.5 -27.5 -30.0 -20.0 -22.5 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 rl in (db) f (g z) h -10 -12.5 -15.0 -25.0 -17.5 -27.5 -30.0 -20.0 -22.5 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 rl out (db) f (g z) h figure 7. rl cpl figure 8. rl iso -10 -12.5 -15.0 -25.0 -17.5 -27.5 -30.0 -20.0 -22.5 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 rl cpl (db) f (ghz) -10 -12.5 -15.0 -25.0 -17.5 -27.5 -30.0 -20.0 -22.5 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 rl iso (db) f (ghz)
docid023414 rev 2 5/9 CPL-WBF-00D3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions figure 10. footprint - non solder mask defined figure 11. footprint - solder mask defined ubm: ? 220 m in out cpl iso gnd gnd 1100 m 1900 m (-332, +732) (-58, +200) (-58, -200) (-332, -732) (+342, -300) (+342, +300) 200 m 625 50 m copper pad diameter: 220m recommended 180m minimum 260m maximum solder mask opening: 320m recommended 300m minimum 340m maximum solder stencil opening: 220m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening: 220m recommended 180m minimum 260m maximum copper pad diameter: 320m recommended 300m minimum solder stencil opening : 220m recommended
package information CPL-WBF-00D3 6/9 docid023414 rev 2 figure 12. marking figure 13. land pattern recommendations x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) pad diameter: 220 m pad to gnd: 130 m
docid023414 rev 2 7/9 CPL-WBF-00D3 package information figure 14. tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348: ?ipad? 400 m flip chip: packag e description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.2 0.22 2.0 st st st xxz xxz xxz yww yww yww
ordering information CPL-WBF-00D3 8/9 docid023414 rev 2 3 ordering information 4 revision history table 4. ordering information order code marking package weight base qty delivery mode CPL-WBF-00D3 sd flip chip 2.35 mg 5000 tape and reel (7?) table 5. document revision history date revision changes 09-jan-2013 1 initial release 09-aug-2013 2 updated footprint graphics.
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